MicroSD storage is everywhere; from mobile devices to cameras and industrial systems, the microSD format has become an industry standard. Greenliant is a Silicon Valley, California-based company that designs and manufactures its own line of solid-state drives (SSDs) and memory cards, and today we will examine two products from their lineup, Industrial Temperature (-40°C to 85°C) . ) 64 GB and wide temperature (-25°C to 85°C) 1TB microSD cards that promise high performance and strong endurance for even the most demanding tasks.
The microSD removable miniaturized Secure Digital flash memory cards were originally called: T-flash or TF, abbreviations of TransFlash. TransFlash and microSD cards are functionally identical, allowing them to be used in devices made for the other. At CTIA Wireless 2005, the SDA announced the small microSD form factor, along with high-capacity SDHC secure digital formatting in excess of 2 GB with a minimum sustained read and write speed of 17.6 Mbit/s. The SDA approved the final microSD specification on July 13, 2005. Initially, microSD cards were available in 32, 64, and 128 MB capacities.
Greenliant’s SD/microSD ArmorDrive family (93 series) consists of highly reliable, industrial flash memory cards in a wide selection of capacities and durability specifications with 1-bit-per-cell (SLC), 3-bit-per-cell (TLC ) ) or 4-bit-per-cell (QLC) 3D NAND configurations. Operating in extreme temperatures, these products are ideal for applications requiring removable data storage that can withstand demanding environments with high workloads.
The 93 series product family implements advanced NAND flash management technology to maintain data integrity and extend memory card life. Built in standard SD and microSD card form factors and backed by Greenliant technical support, SD and microSD ArmourDrive memory cards offer industrial, medical, gaming, video and imaging customers additional flexibility in selecting reliable, hot-swappable solids -state storage for space-constrained, embedded systems.
— Industrial PC
– Point of sale
— Security / Surveillance
— Industrial Automation & Control
– Data Logger
— Test & measure
— Handheld scanner
— Professional video / photo
Most important features:
microSD form factor and interface (15 x 11 x 1.0 mm)
– Compliant with SD specification version 6.10
– Supports SD and SPI protocols
– Sequential read/write performance up to 100MB/s / 85MB/s
– Bus speed mode up to UHS-I 104
– Class 10 Speed performance rating
– 3.3V low power supply
– Active mode less than 405mA
– Standby mode less than 1mA
Advanced Flash Management
– Dynamic and static wear leveling algorithms maximize product life
– Replaces bad blocks with spare blocks in the NAND flash to avoid unrecoverable errors
– Uses advanced bit error detection and correction optimized for 3D NAND SSD Lifespan Monitoring
– Supports SMART command-based alerts that indicate product life remaining
– CPRM support (optional)
– Password protection (optional)
– MTBF: 3M hours (SLC/TLC); 2 million hours (QLC)
– Shockproof (1500G) and vibration resistant (20G)
– Waterproof (water depth up to 1000mm)
Power Outage Data Protection
– Helps prevent data corruption during unexpected power outages
Wide range of capacities
– EX Series (SLC): 8GB – 64GB
– PX series (TLC): 32 GB – 256 GB
– QX Series (QLC): 256 GB – 1 TB
– Industrial: -40°C to +85°C
– Wide: -25°C to +85°C
The 93 series comes in either SD or microSD format with the following NAND flash storage categories:
Image credit: IBM Research, Flash Memory Summit
SLC NAND: Highest Endurance – Con: Duration
Single-level cell (SLC) NAND stores 1 bit of information per cell. The cell stores a 0 or 1 and as a result, the data can be written and retrieved faster. SLC offers the highest endurance up to 100,000 P/E Cycles and superior data retention, so it lasts longer than the other types of NAND. However, the low data density makes SLC the most expensive type of NAND and is therefore not commonly used in consumer products. It is mostly used for industrial and network applications that require superior endurance and long-term reliability.
TLC NAND: Cheaper and higher capacities – Con: Low stamina
Triple-level cell (TLC) NAND stores 3 bits per cell. Adding more bits per cell reduces costs and increases capacity. However, this has negative effects on endurance, which is usually 3,000 P/E cycles for 3D TLC NAND. Many consumer products will use TLC because it is a cheaper option.
QLC NAND: Cheapest & Highest Abilities – Con: Lowest Stamina
Quad-level cell (QLC) NAND stores 4 bits per cell, further increasing capacity and reducing cost. However, the stamina is significantly reduced to 1,000 P/E cycles or less. For applications that do not require high durability, QLC is attractive due to its lower cost.
Over the past decade, 3D NAND has been one of the biggest innovations in the flash market. Flash manufacturers developed 3D NAND to correct the problems they experienced when shrinking 2D NAND to achieve higher densities at a lower cost. In 2D NAND, the cells that store the data are placed horizontally next to each other. This means that the amount of space the cells can be placed in is limited and trying to make the cells smaller reduces their reliability. Therefore, NAND manufacturers decided to stack the cells in a different dimension, leading to 3D NAND where the cells are stacked vertically. The higher memory density allows for higher storage capacities without the huge price increase. 3D NAND also provides better endurance and lower power consumption.